|
本帖最后由 掃街 于 2010-1-29 15:36 編輯 ' ^. v. X: r( z' |
/ U5 v1 M0 s) I! M3 N% t
Fabrication(EBF3),電子束無模成形制造技術。是目前最為先進的直接制造技術(Direct Manufacturing),它可以從計算機3D模型直接成型出機械零件。與現有的快速成型技術(RP,rapid prototyping)不同的是,EBF3技術可以直接成型鈦(titanium)、鎳( nickel)、不銹鋼(stainless steel)和其它有較高熔點的合金(refractory alloys)零件。EBF3將改變傳統的金屬加工制造模式,隨著這一技術的進一步成熟,EBF3將首先應用于航空制造業、軍工制造業和汽車制造業,大大縮短零件制造周期,減少原材料浪費,降低成本;并且有利于太空零件加工和空間設備維修。 0 H, w7 r5 @# W# w1 K- X( T
美國宇航局蘭利研究中心(NASA Langley Research Center)日前對外演示了這項新技術。據了解,NASA已經獲得了這項目技術的發明專利(#7,168,935),其它相關專利正在申請中,美國Sciaky Inc等公司為EBF3技術的合同商。8 E3 w, }/ I: [# `2 R1 [ P/ T+ ~
EBF3,電子束無模成形系統見圖dd5 J% D! E3 t7 R) h& i: a; N/ b
EBF3制造出的樣件見圖ee' B! G) I! x1 B* T' |
EBF3真空室見圖ff
2 r! M5 P0 s2 t2 z, O" r( o bEBF3控制面板見圖gg
* Z( R0 I7 n2 [: DEBF3 主要技術參數 4 X0 _: T/ O4 d8 m
Current build volume:6 in. x 6 in. x 6 in. (15.24 cm x 15.24 cm x 15.24
" }- P! A# a# Z* U, zcm)
2 `) W1 Y7 h" u; Z Maximum build size: 6 in. x 6 in. x 6 in. (15.24 cm x 15.24 cm x 15.24 cm)4 f: }. p, h6 N, R }
Layer thickness: 0.02 in. – 0.05 in. (0.5 mm – 1.27 mm)3 h y; y2 S* `2 O9 w S
E-beam scan speed:Not applicable
P# o/ v1 u! a5 y9 O" Q Deposition rate:5 cubic in. per hour (80 cubic cm per hour)
. t5 [6 ^" |/ a% i0 P% V' A E-beam positioning accuracy:±0.005 in. (±0.127 mm) B* q+ H( w) l+ l* ^) p
Part accuracy:±0.1 in. (±2.54 mm) has been demonstrated, and experience * f! D r0 G$ f9 N- W/ b
suggests that accuracy of ±0.05 in. (±1.27 mm) could eventually be # @$ M% S' D/ l$ O2 D4 g6 X& S
achieved/ Z |0 M; D$ d6 }
Calibration:Automatic
" n6 n# z T5 C8 N" H/ S Cooling:Automatic. C& R c! S5 T4 _# S% { d
Power supply:Max: 30 kV, 100 mA, 3 kW
$ {" h2 H: @ ~6 H/ Z Size:Standard 19-in. (48.26-cm) rack-mounted controls
( U8 l1 h3 r9 Y$ | Chamber option 1: 32 in. W x 42 in. H x 32 in. D, p" X% o( ?1 b$ C
(107 cm W x 107 cm H x 81 cm D)
& N4 K; h- |8 w( U( W* @! _: n& f ~ Chamber option 2: 24 in. diameter x 24 in. high$ O1 q. D+ r3 I$ [1 N
(61 cm x 61 cm)
8 e9 J5 T0 _, u c5 i Total system weight: 350 lbs. (160 kg)
$ {/ v" W# S: S: r% V/ R: d* h9 D4 x Process computer:PC, XP, LabVIEW Interface
- `% R. }$ D: d& x+ p% ] CAD interface:Standard: STL or other engineering CAD/CAM (ProE, CATIA,
! C2 X L; T* j7 E% Y( d FeatureCAM, MasterCAM)
7 Y0 }# J: {1 ~7 `) Z% S Network:Ethernet: 10/1007 P+ |1 ]' O/ Y! Q! u1 v. _" ?4 h
Certification:NASA’s partners are seeking aerospace certification |
|