外媒評論solidworks PCB 標題：MCAD+ECAD and Intelligent Lifecycle 機械CAD 電氣CAD與智能生命周期" I- r( [6 w; ?+ `( T
The time when you product was a piece of machinery is over. These days, every product is a combination of at least 3 elements – mechanical, electronic and embedded software. It usually comes together with an additional piece of software (mobile or cloud). Welcome to the reality of multi-disciplinary data and smart products!
, F8 G% X$ g' H產(chǎn)品單純是機械的時代已經(jīng)結(jié)束，現(xiàn)在都是三合一，機械、電氣、嵌入式軟件。
r& g5 M( B+ [2 JTechnology is easy. People are hard. When it comes to management of mult-disciplinary data, think first about people who are in charge of all these pieces of information. There are multiple levels of integration between multi-disciplinary data. It can be 3D model level integration. A typical example of bringing 3D models of electronic components such as PCB design into MCAD tools. Another dimension of multi-disciplinary data is integrated bill of materials. Technical difficulties and disagreement between people often can lead to problems in establishment of cohesive multi-disciplinary data management solutions. PLM fails to provide a way to manage multi-disciplinary BOM and changes. High-tech and electronic industry is specific because of high diversity of design tools – mechanical, electronic, software. PLM tools are not integrated well with design tool, which leads to poor BOM management – limit of tools, complexity integration between tools provided by multiple suppliers.
+ A0 [3 H2 U& ? ?4 U" ^! l4 rPLM整合多學科數(shù)據(jù)的困難性4 Z- ?9 q2 t+ P' o6 |
In the past, the MCAD-ECAD collaboration headache was a simple communication problem: To come up with a neutral file format that lets each discipline transmit its respective design to the other. But to design a connected device, where the outer shell and the internal parts must fit like hand and glove, the two sides must work together closer than ever before. 8 x5 c( g/ g8 X) w; `
過去，機械CAD與電氣CAD協(xié)作溝通困難，所以才有中間文件格式。
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A format like IDF (intermediate data format), which is supported by most industry-standard software from both sides, removes the communication barrier between MCAD and ECAD disciplines, but many experts feel a new lingua franca is needed. EDMD (electrical design mechanical design) is a protocol championed by ProSTEP iViP, an international association that develops and defines standards for product data management and virtual product creation. “It’s actively maintained, so we meet with other CAD and ECAD vendors monthly or bimonthly to develop it to include what the modern designers need,” says Eckhoff.
G( Y5 s' a$ }6 u像IDF這樣的文件格式，支持多數(shù)行業(yè)標準軟件。打破機械CAD與電氣CAD溝通障礙。但是新的通用語言是必要的，% w9 c3 t* U/ s* \
& X' w9 {1 H/ YAt the core of PCBWorks is a set of powerful schematic capture and PCB layout tools along with an easy-to-use interface that works in tandem with existing mechanical workflows in SolidWorks. Design data between components and mechanical enclosures are linked seamlessly between electrical and mechanical workflows, with the world’s first-ever managed Engineering Change Orders (ECO) process delivering changes in design data from SolidWorks to PCBWorks using native SolidWorks files.
! q* b+ V, W" Hsolidworks pcb 的核心是一個PCB原理布局工具和易于使用的界面，在現(xiàn)有的機械工作流上溝通solidworks。組件間的設(shè)計數(shù)據(jù)和機械零件在機電工作流中無縫銜接。: d% g) {8 e7 ~
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What will be a trajectory of integrated development between Altium and Solidworks? Will it lead to more advanced design system integration beyond SOLIDWORKS? Will Dassault Systemes decide to acquire Altium to create MCAD+ECAD bundle? These are all good questions to ask…* S6 q/ w! Q1 i9 s6 S3 R5 Y
EDA vendors and vision of intelligent lifecycle) {2 i5 R$ X& B3 t' z( e! s
To solve design information exchange is very important. But what is next? How multi-disciplinary design will connect into the process of manufacturing, services, maintenance. These are questions usually asked by MCAD companies bringing a concept of PLM to manage overall product lifecycle.
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4 b) n F6 h$ V$ z) X* Z+ m ZWhat is my conclusion? Modern products are creating significant amount of complex design and manufacturing planning challenges. The core cause of that is in an increased product complexity, integration of multi-disciplinary data, introduction of IoT and connected technologies. Distributed manufacturing makes the design and manufacturing planning even more complex. Software vendors will be forced to think outside of a traditional silos to solve these problems. Just my thoughts..
* A3 V! C& d) ?! i$ C+ L3 _現(xiàn)代產(chǎn)品是創(chuàng)建大量的復雜的設(shè)計和制造計劃的挑戰(zhàn)。核心原因是產(chǎn)品復雜性增加,多學科的集成數(shù)據(jù),引入物聯(lián)網(wǎng)和連接技術(shù)。分布式制造設(shè)計和制造規(guī)劃更加復雜。軟件供應(yīng)商將被迫跳出傳統(tǒng)的束縛來解決這些問題0 w# v. A6 M+ c" z
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發(fā)表于 2016-3-21 19:23:22
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